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Yang, Ping; Li, Wei Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models. (English) Zbl 1419.74105 Int. J. Numer. Model. 22, No. 1, 43-55 (2009). MSC: 74F05 74S05 PDFBibTeX XMLCite \textit{P. Yang} and \textit{W. Li}, Int. J. Numer. Model. 22, No. 1, 43--55 (2009; Zbl 1419.74105) Full Text: DOI
Walker, S. P.; Bluck, M. J.; Chatzis, I. The stability of integral equation time-domain scattering computations for three-dimensional scattering; similarities and differences between electrodynamic and elastodynamic computations. (English) Zbl 1012.78009 Int. J. Numer. Model. 15, No. 5-6, 459-474 (2002). Reviewer: Johannes Elschner (Berlin) MSC: 78A45 78M15 74H15 PDFBibTeX XMLCite \textit{S. P. Walker} et al., Int. J. Numer. Model. 15, No. 5--6, 459--474 (2002; Zbl 1012.78009) Full Text: DOI
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