Adamaszek, Michał; Adams, Henry On Vietoris-Rips complexes of hypercube graphs. (English) Zbl 1490.05279 J. Appl. Comput. Topol. 6, No. 2, 177-192 (2022). MSC: 05E45 55P10 55U10 55N31 PDFBibTeX XMLCite \textit{M. Adamaszek} and \textit{H. Adams}, J. Appl. Comput. Topol. 6, No. 2, 177--192 (2022; Zbl 1490.05279) Full Text: DOI arXiv
Adams, Henry; Bush, Johnathan; Mirth, Joshua Operations on metric thickenings. (English) Zbl 1487.55006 Spivak, David I. (ed.) et al., Proceedings of the 3rd annual international applied category theory conference 2020, ACT 2020, Cambridge, USA, July 6–10, 2020. Waterloo: Open Publishing Association (OPA). Electron. Proc. Theor. Comput. Sci. (EPTCS) 333, 261-275 (2021). Reviewer: Ziga Virk (Ljubljana) MSC: 55N31 54E35 55P10 55U10 05E45 18F99 PDFBibTeX XMLCite \textit{H. Adams} et al., Electron. Proc. Theor. Comput. Sci. (EPTCS) 333, 261--275 (2021; Zbl 1487.55006) Full Text: arXiv Link
Adamaszek, Michał; Adams, Henry; Gasparovic, Ellen; Gommel, Maria; Purvine, Emilie; Sazdanovic, Radmila; Wang, Bei; Wang, Yusu; Ziegelmeier, Lori On homotopy types of Vietoris-Rips complexes of metric gluings. (English) Zbl 1455.55005 J. Appl. Comput. Topol. 4, No. 3, 425-454 (2020). Reviewer: Yuichi Ike (Kawasaki) MSC: 55N31 55U10 68T09 55P15 05E45 PDFBibTeX XMLCite \textit{M. Adamaszek} et al., J. Appl. Comput. Topol. 4, No. 3, 425--454 (2020; Zbl 1455.55005) Full Text: DOI arXiv
Adamaszek, Michał; Adams, Henry; Gasparovic, Ellen; Gommel, Maria; Purvine, Emilie; Sazdanovic, Radmila; Wang, Bei; Wang, Yusu; Ziegelmeier, Lori Vietoris-Rips and Čech complexes of metric gluings. (English) Zbl 1489.68330 Speckmann, Bettina (ed.) et al., 34th international symposium on computational geometry, SoCG 2018, June 11–14, 2018, Budapest, Hungary. Wadern: Schloss Dagstuhl – Leibniz Zentrum für Informatik. LIPIcs – Leibniz Int. Proc. Inform. 99, Article 3, 15 p. (2018). MSC: 68U03 55N31 PDFBibTeX XMLCite \textit{M. Adamaszek} et al., LIPIcs -- Leibniz Int. Proc. Inform. 99, Article 3, 15 p. (2018; Zbl 1489.68330) Full Text: DOI