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Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion. (English) Zbl 0964.74073
From the summary: We describe a three-dimensional finite element method for predicting the behavior of a solid which changes its shape as a result of strain and electromigration induced surface diffusion. The numerical procedure is described in detail. To demonstrate the accuracy and capabilities of the method, we solve two problems of interest to microelectronic industry.

74S05 Finite element methods applied to problems in solid mechanics
74A50 Structured surfaces and interfaces, coexistent phases
78A55 Technical applications of optics and electromagnetic theory
Full Text: DOI
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